Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics Devices

for their time and efforts in reviewing the proposals and dissertations and their helpful advices. My sincere gratitude goes to DARPA and Intel Corporation for their financial support. I would also like to thank the University of Maryland College Park for their financial support in the form of Graduate School Fellowship. I would also like to take this opportunity to express my appreciations and thanks to my friends in the Microelectronics and Emerging Technologies Thermal Laboratory for their support and help. Special acknowledgement goes to my wife Xiaoyuan for her continuous support throughout my years as a graduate student. iii TABLE OF CONTENTS ACKNOWLEDGEMENT iii LIST OF TABLES vi LIST OF FIGURES vii LIST OF SYMBOLS OR ABBREVIATIONS xi SUMMARY xvii CHAPTER 1 INTRODUCTION 1 1.1 Motivation 2 1.2 Literature review 6 1.2.1 Review of microchannel concepts 6 1.2.2 Review of experimental studies in microchannel 8 1.2.3 Review of analytical studies in micro-channel 9 1.2.4 Review of Micro Particle Image Velocimetry techniques for micro-channel flow 10 1.3 Objectives 14 1.4 Overview of the current study 15